by Radio frequency transmitter encapsulants are thermosetting elastomers that provide protection against electromagnetic interference for sensitive electronic modules and circuits. They are primarily used as conformal coatings on printed circuit boards or assemblies to protect components and wiring from moisture, chemicals, dust, sand and electromagnetic interference. These encapsulants help extend product life and performance in harsh operating environments like aerospace, military, industrial equipment and medical devices.
The global Radio Frequency Transmitter Encapsulant Market is estimated to be valued at US$ 2.92 Bn in 2023 and is expected to exhibit a CAGR of 8.3% over the forecast period 2024 to 2031, as highlighted in a new report published by Coherent Market Insights.
Market Dynamics:
According to the report, radio frequency transmitter encapsulants are increasingly being used as conformal coatings for printed circuit boards and assemblies in sectors like telecommunication, automotive, industrial electronics and medical devices where there is a need to protect electronic circuits from moisture, dust, chemicals and electromagnetic radiation. Growing demand for technologically advanced products across these end use industries is fueling the need for reliable encapsulation solutions.
Segment Analysis
The global radio frequency transmitter encapsulant market is segmented into type, application, and end-use. Based on type, the epoxy resin segment accounts for over 50% market share in 2021 and is expected to continue dominating the market during the forecast period. This dominance is attributed to high chemical resistance, adhesion, and mechanical strength properties offered by epoxy resins.
PEST Analysis
Political: Government regulations regarding use of certain chemicals in medical devices may impact market growth of RF encapsulants. However, increasing budget allocation for healthcare infrastructure development across major economies presents growth opportunities.
Economic: The global economy has picked up pace post pandemic which has positively impacted the overall medical device industry and thus the demand for RF encapsulants.
Social: Rising incidence of chronic conditions like cancer requiring minimally invasive surgeries and remote monitoring is driving demand for medical implantables and hence RF encapsulants.
Technological: Advancements in material sciences have led to the development of encapsulants with enhanced properties like biocompatibility and electrical insulation which are enabling miniaturization of medical implants.
Key Takeaways
The Global Radio Frequency Transmitter Encapsulant Market Size is expected to witness high growth at a CAGR of 8.3% during the forecast period of 2024 to 2031. The global radio frequency transmitter encapsulant Market is estimated to be valued at US$ 2.92 Bn in 2024 and is expected to exhibit a CAGR of 8.3% over the forecast period 2024 to 2031.
Regional analysis related content comprises Regional analysis related content
North America dominates the RF encapsulant market currently with a share of over 35% in 2024 driven by high healthcare spending in countries like the US and Canada. Presence of leading medical device manufacturers and increasing use of implantable medical devices for remote patient monitoring also contributes to its large market size. Asia Pacific is expected to emerge as the fastest growing regional market during the forecast period owing to rising medical tourism, quick adoption of advanced technologies, and increasing healthcare investments by governments in countries like India and China.
Key players
Key players operating in the radio frequency transmitter encapsulant market are Medtronic Plc, Johnson & Johnson, SMI, Advanced Medical Solutions Group plc, GMD Group (General Medical Disposable), Bentley Healthcare Pvt. Ltd. Key players are focusing on developing novel bioabsorbable and nanomaterial-based RF encapsulants with enhanced properties.
Note:
1. Source: Coherent Market Insights, Public sources, Desk research
2. We have leveraged AI tools to mine information and compile it
